Cut and split brittle glass with chipping under 5 microns.
Picosecond cutting and splitting uses an ultrafast laser to cut brittle glass cold, holding plus or minus 0.01 mm accuracy from 0.03 to 25 mm thick at up to 500 mm/s. Irregular shapes cut with no taper and no burrs, chipping stays at 5 microns or less, and the process makes no powder and no waste water.
Built for picosecond cutting & splitting.
Irregular shapes at speed
The picosecond laser cuts freeform and irregular shapes at high speed, opening designs that mechanical scoring cannot follow.
Chipping under 5 microns
Cuts come out with no taper, no burrs and chipping of 5 microns or less, so parts often need no secondary finishing.
Thin to thick brittle glass
One platform handles ultra-thin UTG and willow glass up to thick optical and architectural glass, from 0.03 to 25 mm.
Clean and high-yield
No powder and no waste water, with low consumables and energy use, improving the economics of brittle-glass cutting.
What it runs on.
The machine for the job.
Picosecond Glass Cutting & Splitting Machine (Single/Dual Station)
Ultrafast picosecond cutting and splitting for brittle glass, accurate to ±0.01 mm with chipping under 5 microns.
View the Picosecond Glass Cutting & Splitting Machine (Single/Dual Station) →
Laser Drilling & Cutout Machine
Single-beam double-head laser drilling and cutout, built for shower-room glass.
View the Laser Drilling & Cutout Machine →Real parts on real glass.
Put picosecond cutting & splitting to work.
Send us your glass type and the result you need. Gudetech engineers will spec the machine and reply with a quote and the process specs for the process running on glass like yours.